EP30FLAO two-component epoxy resin is suitable for cryogenic applications and useful for potting, bonding, sealing, and coating.

Features & benefits

  • Low viscosity, excellent flow; designed for electronic, electrical, computer, metalworking, appliance industries

  • 4K to 250° F; 9 to 10 BTU/in/ft2/hr/°F thermal conductivity

  • 5,000 to 6,000 cps at 75° F; low thermal expansion coefficient, superior dimensional stability, toughness; Parts A and B are available in half pint to five-gallon containers

Master Bond
(201) 343-8983