A new heat sink design promises to keep integrated circuits 20 to 30% cooler than can conventional pin-fin heat sinks.
Conventional pin-fin heat sinks are considered one of the most efficient heat sink designs. The new UltraCool P takes the standard round pin design and splays each pin outward, expanding the distance between pins. Though possessing the same surface area as other pin heat sinks, the extra space between pins lets air flow through the array more efficiently. This makes the new design well suited for low airspeed and natural convection cooling.
Developed by Cool Innovations Inc., in Toronto, the UltraCool P is forged from pure aluminum and oxygen-free copper. A wide range of standard sizes include models from 0.5 0.5 in. to 2 2 in., in heights from 0.2 to 1.1 in. The splayed line handles any surface-mount package. The heat sink attaches using doublesided thermal tape as well as mechanical clips.