A new flexible, tough epoxy potting and encapsulation compound called EP30FL can be used in both thick and thin cross sections.
It is 100% reactive and contains no volatiles. The compound generates low exotherm during cure even though it cures relatively quickly at room temperature. Its cure shrinkage is low and it bonds to similar and dissimilar substrates. Because of its flexibility it’s a candidate for use in environments exposed to thermal cycling. Additionally it can withstand mechanical shock and vibration, is water resistant, and in the cured state can serve as an electrical insulator. The compound comes in half pint, pint, quart, gallon, and five gallon kits.
Master Bond Inc.
154 Hobart St.
Hackensack, NJ 07601