It offers a low dielectric constant (Dk = 2.9) for controlled impedance combined with excellent dimensional stability for dense fine-line applications. It comes in a range of copper and film thicknesses, and is available in standard panel formats. R/flex 3000 materials offer a combination of mechanical, electrical, thermal, and environmental properties. Applications include moisture-resistant sensors, next-generation wireless handsets, high-density flip-chip packages, and tightly controlled impedance-flux interconnections.