The family of epoxy and epoxide formulations mixes and pours easily, fills voids completely, cures with minimal air entrapment, and reportedly provides environmental and impact resistance. They come in silver and copper-filled versions. The materials are suited for applications requiring a conductive bond and hot soldering is impractical. It can be used to form conductive paths on circuit boards, prepare electrodes for capacitance and loss measurements, in RF shielding, and heat sinks. Curing is at room or elevated temperatures, and service temperatures range from 65 to 200°F.

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