EPM-2480, EPM-2481, and EPM-2482 dielectric gels are for encapsulation of chip packages in devices where outgassing-related contamination poses a problem.
They cure into a soft, compliant silicone that reduces stress on electronic assemblies during temperature cycling. They also protect against environmental factors and shock.
EPM-2480 and EPM-2481 are based on dimethyl silicone systems. EPM-2480 has a lower viscosity and is firmer than EPM-2481. EPM-2482 is based on a diphenyl-dimethyl silicone system, which gives it better temperature stability. The gels are two-part systems that come in 50-gm and 50-ml kits.