September 26, 2024
2:00 PM ET / 1:00 PM CT / 11:00 AM PT / 7:00 PM GMT
Duration: 1 hour
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Summary
Modeling and simulation is an efficient way of analyzing packaging and testing processes to develop a strong understanding of how they may impact designs and performance. Multiphysics simulation software, in particular, provides the basis for reliable and accurate representations of the real-world devices.
In this webinar, we will discuss how the COMSOL Multiphysics® software can be used to simulate and analyze common issues in the packaging and testing of electronic devices, including semiconductor devices. The software includes functionality for modeling electrical performance verification of packaging, thermal management designs, residual stress and warpage caused by reflow soldering processes, curing and demolding of encapsulation materials, structural stress in high temperature and high humidity environments, and structural fatigue under cyclic thermal loads.
Speakers
Andy Cai
COMSOL
Sponsored by:
