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    Water-debondable epoxy - Henkel Corp.

    Sept. 5, 2011
    The epoxy bonds silicon ingots to substrates for wafer slicing and debonds with hot water.

    Loctite 3382 water-debondable epoxy adhesive bonds silicon to glass and metal mounting substrates used during the ingot sawing process and debonds with hot water. The epoxy eliminates the need for corrosive debonding solutions and minimizes silicon waste during wafer cleaning. It emits no caustic odor and will not corrode equipment.
    The two-part epoxy dispenses with meter-mix equipment and sets up to a contrasting pink in 5 to 7 hr. It comes in cartridges, pails and drums.

    Henkel Corp., 1 Henkel Way, Rocky Hill, CT 06237, (860) 571-5100, www.henkelna.com

    About the Author

    Jessica Shapiro

    Jessica serves as Associate Editor - 3 years service, M.S. Mechanical Engineering, Drexel University.

    Work experience: Materials engineer, The Boeing Company; Primary editor for mechanical and fastening & joining.

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