Master Bond EP114 Is an Advanced Nanosilica Epoxy System
Infused with nanosilica, this two-component epoxy system from Master Bond is suitable for potting, coating and sealing applications. EP114’s nanoparticles are designed for dimensional stability, reducing shrinkage when cured.
The epoxy system has a 100:80 mix ratio by weight with low viscosity and an extended open time of 2 to 4 days. EP114 does require oven curing, typically following a cure schedule of 2 to 3 hours at 250°F, 5 to 8 hours at 300°F, and a post-cure at 350°F for at least 2 hours.
Key features of EP114 include:
- Low viscosity and exceedingly long open time
- Low shrinkage upon curing
- Dimensional stability
- Tested for abrasion resistance per ASTM D4060-14
- Withstands 1,000 hours 85°C/85% RH
- NASA low outgassing approved
According to the company release, the two-component epoxy excels in bonding a range of substrates—from metals and composites to glass, ceramics and plastics, serving as a top-tier electrical insulator. Its high glass transition temperature (Tg) surpassing 200°C allows a service temperature range of −100°F to 550°F. Resistant to water, oils and fuels, EP114 is optically clear with light transmission between 350 to 1,600 nm.
Targeting specialty OEM, electronic and optical sectors, EP114 is available in a range of sizes and units—including cans, pails and syringes—to accommodate users’ needs.
