Placement Head For SMT

It was developed for true rotary application and can index its spindles within 55 msec, setting a new industry benchmark for placement head duty cycle. The head has 30 spindles, dual on-the-head cameras, and can place sub-0201 components, CSP, WSP, m -BGA, and others up to 30-mm square. An optional embedded process verifier operates concurrently with placement to provide two images at every pick-and-place event for immediate analysis and refinement. The system work's with Universal's AdVantis and dual-head Genesis platforms. It enables 30,000-cph placement rates in the AdVantis application, while Genesis delivers 54,000-cph high-speed placement performance when fitted with twin Lightning heads.

Universal Instruments Corp.,
Box 825, Binghamton, NY 13902,
(607) 779-4079, www.uic.com