In the electronics industry, contract manufacturing — the outsourcing of design and production to a third party — has long been a strategy for reducing time to market and simplifying project oversight in response to fluctuating market demand. Today, however, many companies are choosing to go further, outsourcing greater portions of subassembly and device production. This increases the complexity of the entire production process. Even more importantly, it saddles manufacturing decision makers with a new challenge: Determining how well a production process handles complex builds.
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