The material's high thermal conductivity (200 W/mK) lets it achieve maximum brightness in LED lamps at the lowest possible operating temperature. Unlike copper and aluminum metals that have high thermal-expansion values, AlSiC has a low coefficient of thermal expansion (CTE). This minimizes thermally induced stress and reduces failures of delamination and cracking. This reduction improves LED reliability. With a compatible CTE value, the need for thermal stress compensating interface layers is also eliminated. A net-shape fabrication process produces the material and fabricates product geometry, including throughhole and threaded-hole features. This cost-effective process allows tight tolerances without machining and provides high-volume assembly yields. The casting process also simplifies use of high thermal conductivity inserts (>1,000 W/mK) for thermal dissipation.

CPS Corp.,
111 S. Worcester St., Chartley, MA 02712,
(508) 222-0614,