The two-part adhesive reportedly develops strong, durable bonds and can be roomtemperature or heat cured. The rigid compound is suited for staking transistors, diodes, resistors, integrated circuits, and other heat-sensitive applications. Its coefficient of thermal expansion permits bonds to many materials, including metals, silica, alumina, ceramics, glass, and plastics. Tra-Bond 2151 also passes NASA's outgassing specifications.
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