METAL-MATRIX COMPOSITE WITH TAILORED THERMAL EXPANSION
with a coefficient of thermal expansion (CTE) that can be tailored to meet the needs of various electronic devices and assemblies. The isotropic CTE value of AlSiC can be adjusted by modifying the Al-metal/ SiCparticulate ratio. The material's CTE matching capabilities eliminate the need for thermalinterface stacking, increasing reliability in the field. The capability can also be used in the housing, interconnection, and thermal management of microelectronic, optoelectronic, and power electronic devices. AlSiC has high thermal conductivity which coupled with superior CTE matching prevents bowing and flexing of packaging and substrates that can lead to failures. Parts made from the material are cast to near and netshape and can accommodate high thermal conductivity inserts (>1,000 W/mK) or cooling tubes for more-advanced thermal management.
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