Freescale Semiconductors, a leading manufacture of embedded semiconductors based in Austin, Tex., is looking for innovative and environmental designs that make use of its components.
So they are inviting engineers and engineering students from around the world to participate in their Freesscale Technology Forum (FTF) Design Challenge.
"Energy management and other green issues are becoming major considerations in virtually every purchase decision, consumer and corporate," said Mayer. "We encourage the FTF Design Challenge participants to experiment and test the boundaries in designing energy efficient products."
Freescale is hosting Design Challenges in the Americas, Israel, Japan, Europe, India and China to reward the most inventive green embedded designs. The Americas Challenge is open to engineers and students, individuals and teams, in the U.S., Canada, and Mexico.
Entrants must use at least one of the following: MMA7260Q acceleration sensor; MPXV5004 pressure sensor; MC9328MXS i.MXS; MC1321X ZigBee package; MCF51QE128 microcontroller; S12XE automotive microcontroller; or MPC8313E-RDB PowerQuicc II Pro processor. (Designs will earn extra points for using increasing levels of Freescale components. See rules online for more details).
Entries must be submitted online by Jan. 31, 2008. The first place winner will receive $10,000, second place $5,000 and third place $2,000. In addition, regional first place winners will be invited to participate in the Grand FTF Design Challenge, competing against first place winners and other those from Israel, Japan, Europe, China, and India for $50,000 and a ticket to the Freescale Technology Forum 2009 of his or her choice. (Winners must attend FTF.) Regional challenges will open over the next six months in Israel, Japan, Europe, India and China.
For more information about entry requirements, rules, the design selection process and winner notifications, please visit www.freescale.com/designchallenge.