EP21TDCSFL is a two component, room temperature curing, silverfilled epoxy adhesive.
Its elongation is greater than 60%. It has a 1-to- 1 mix ratio by we ight or volume. It can be applied on vertical surfaces with minimal sagging. It is also 100% reactive and does not contain any diluents or solvents. Volume resistivity is less than 10 to 3 Ω cm. It resists mechanical shock resistance and low outgassing properties. It sticks to metals, glass, ceramics, rubbers and many plastics. Operating temperature range is up to 250°F. Tensile shear strength is greater than 1,500 psi and T-peel is over 30 pli. Thermal conductivity is 11 BTU/in/ ft″/hr/°F. It is available in half-pint, pint, quart and gallon kits. It also is available in premixed and frozen syringes.
Master Bond Inc., 154 Hobart St., Hackensack, NJ 07601 (201) 343- 8983, masterbond.com