Flexible Circuit Materials

June 16, 2005
R/flex AP 200 is an all-polyimide 2LFCCL circuit material.

Bonding polyimide onto adhesion-treated copper foil without conventional adhesives makes it. They serve as thin multilayer and rigidflex circuits in cell phone hinge flex, LCD interconnects, and other handheld electronic devices.

Rogers Corp.,
Box 188, One Technology Dr., Rogers, CT 06263,
(860) 779-4045,
rogerscorporation.com

Sponsored Recommendations

MOVI-C Unleashed: Your One-Stop Shop for Automation Tasks

April 17, 2024
Discover the versatility of SEW-EURODRIVE's MOVI-C modular automation system, designed to streamline motion control challenges across diverse applications.

The Power of Automation Made Easy

April 17, 2024
Automation Made Easy is more than a slogan; it signifies a shift towards smarter, more efficient operations where technology takes on the heavy lifting.

Lubricants: Unlocking Peak Performance in your Gearmotor

April 17, 2024
Understanding the role of lubricants, how to select them, and the importance of maintenance can significantly impact your gearmotor's performance and lifespan.

From concept to consumption: Optimizing success in food and beverage

April 9, 2024
Identifying opportunities and solutions for plant floor optimization has never been easier. Download our visual guide to quickly and efficiently pinpoint areas for operational...

Voice your opinion!

To join the conversation, and become an exclusive member of Machine Design, create an account today!