Freescale Semiconductors,
a
leading manufacture
of embedded
semiconductors
based in Austin,
Tex., is looking
for innovative
and envi ronmental
designs
that make use of its components.
So they are inviting engineers
and engineering students from
around the world to participate in
their Freesscale Technology Forum
(FTF) Design Challenge.
“Energy management and other
green issues are becoming major
considerations in virtually every
purchase decision, consumer and
corporate,” said Mayer. “We encourage
the FTF Design Challenge
participants to experiment and
test the boundaries in designing
energy efficient products.”
Freescale is hosting Design
Challenges in the Americas, Israel,
Japan, Europe, India, and
China to reward the most inventive
green embedded designs.
The Americas Challenge is open
to engineers and students, individuals
and teams, in the U.S.,
Canada, and Mexico.
Entrants must use at least one
of the following: MMA7260Q acceleration
sensor; MPXV5004
pressure sensor; MC9328MXS
i.MXS; MC1321X ZigBee package;
MCF51QE128 microcontroller;
S12XE automotive microcontroller;
or MPC8313E-RDB PowerQuicc II
Pro processor. (Designs will earn
extra points for using increasing
levels of Freescale components.
See rules online for more details).
Entries must be submitted online
by Jan. 31, 2008. The first place
winner will receive $10,000, second
place $5,000, and third place $2,000.
In addition, regional first place winners
will be invited to participate
in the Grand FTF Design Challenge,
competing against first place winners
and other those from Israel,
Japan, Europe, China, and India
for $50,000 and a ticket to the Freescale
Technology Forum 2009 of
his or her choice. (Winners must
attend FTF.) Regional challenges
will open over the next six months
in Israel, Japan, Europe, India and
China. For more information about
entry requirements, rules, the design
selection process and winner
notifications, please visit www.freescale.com/designchallenge.